Members Area | Contact Us | Legal Notice | Search
Cobalt Development Institute
Promoting Cobalt Uses in All Forms
Home Page
The Institute
About Cobalt
Cobalt News
Cobalt Facts
Cobalt Abstract
World Patents
HS and E
REACH
REACH Consortium
Sustainability & LCA
Statistics
Conferences
Publications
News
Links
Members Directory
Recruitment
Contact Us


 

Patents - PLATING

Category list

July 2006
PLATING
WO 2005/123987 A1 (12/29/2005) Rambo Chemicals (H.K.) Ltd, Okuno Chemical Industries Co., Ltd.
Kwok C.W.J. Kwok Y.R. Nakagishi Y.
TIN-BASED PLATING FILM AND METHOD FOR FORMING THE SAME
A plating film with suppressed whisker growth has a two-layer structure, the lower layer containing ?5% by weight of cobalt, copper, bismuth, silver or indium, ?95% by weight of tin, and an upper layer comprising not more than ?5% by weight of cobalt, copper, bismuth, silver, and indium, and ?95% by weight of tin.
January 2006
WO 2005/073429 A2 (08/11/05) Applied Materials, Inc.
Weidman T.W., Pancham I., Lubomirsky D., Shanmugasundram A., Shacham-Diamand Y., Moghadam F.
METHOD AND APPARATUS FOR SELECTIVELY CHANGING THIN FILM COMPOSITION DURING ELECTROLESS DEPOSITION IN A SINGLE CHAMBER
A method and apparatus for electroless deposition of a multilayer having discrete or varying composition ont a conductive suface using a single processing cell. The process may be used to form a first layer containing at least two of cobalt, tungsten, phosphorus or boron and second layer contains at least two of cobalt, boron or phophorus.
WO 2004/113866 A3 (07/21/05) Shalyt E, Pavlov M, Bratin P, Kogan A., Perpich M.J.
MEASUREMENT OF COMPLEXING AGENT CONCENTRATION IN AN ELECTROLESS PLATING BATH
A2 published 12/29/04
WO 2004/101854 A3 (05/12/05) Atotech Deutschland GmbH
Joshi N.H., Mehta M.D.
AQUEOUS ALKALINE ZINCATE SOLUTIONS AND METHODS
A2 published 25.11.04
February 2005
"WO 2005/038088 A1 (04/28/05) Kansai Technology Licensing Organization Co., Ltd."
"Shingubara, S.; Takahagi, T.; Wang, Z."
ELECTROLESS COPPER PLATING LIQUID AND METHOD FOR MANUFACTURING WIRING BOARD USING SAME
"An electroless copper plating liquid enabling deposition in large aspect ratio features without forming an air gap, contains mainly a copper sulfate or chloride, a reducing agent such as formaldehyde, divalent cobalt ions and glyoxylic acids, an organosulfur compound of M.W. 60- 1000 of, and an oxyalkylene glycol having a M.W. of 200-20,000."
"WO 2005/038085 A2 (04/28/05) Applied Materials, Inc."
"Weidman, T.; Zhu, Z."
SELECTIVE SELF-INITIATING ELECTROLESS CAPPING OF COPPER WITH COBALT-CONTAINING ALLOYS
Compositions of electroless plating solutions to deposit capping layers free of particles on conductive features are rather dilute and contain strong reductants to self-initiate and may provide in-situ cleaning processes for the conductive layer. They consist of de-ionized water with a conditioning buffer solution containing a cobalt source and a buffered reducing solution comprising a hypophosphite source and a borane reductant.
"WO 2005/038084 A2 (04/28/05) Applied Materials, Inc."
"Weidman, T.; Zhu, Z."
SELECTIVE SELF-INITIATING ELECTROLESS CAPPING OF COPPER WITH COBALT-CONTAINING ALLOYS
"Electroless plating solutions to deposit capping layers, free of particles, on conductive features are dilute and contain strong reductants to self-initiate, and may provide in-situ cleaning processes for the conductive layer. They consist of de-ionized water with a conditioning buffer solution containing a cobalt source and a buffered reducing solution of a hypophosphite and a borane reductant."
WO 2005/010233 A3 (02/24/05) Atotech Deutschland GmbH
"Joshi, N. H.; Mehta, M. D."
AQUEOUS ACIDIC IMMERSION PLATING SOLUTIONS AND METHODS FOR PLATING ON ALUMINUM AND ALUMINUM ALLOYS
A2 published (02/03/05)
WO 2005/010233 A2 (02/03/05) Atotech Deutschland Gmbh
"Joshi, N. H.; Mehta, M. D."
AQUEOUS ACIDIC IMMERSION PLATING SOLUTIONS AND METHODS FOR PLATING ON ALUMINUM AND ALUMINUM ALLOYS
"A non-cyanide aqueous acidic immersion plating solution used for depositing zinc alloy protective coatings on aluminum and aluminum alloy substrates has a pH of about 3.5-6.5 and comprising zinc ions, nickel ions and/or cobalt iron ions, and fluoride ions and an inhibitor containing nitrogen and/or sulfur atoms."
"WO 2004/113866 A2 (12/29/04) Shalyt, E.; Pavlov, M.; Bratin, P.; Kogan, A.; Perpich, M. J."
"Shalyt, E.; Pavlov, M.; Bratin, P.; Kogan, A.; Perpich, M. J."
MEASUREMENT OF COMPLEXING AGENT CONCENTRATION IN AN ELECTROLESS PLATING BAT
"Citrate complexing agent in an electroless cobalt or nickel plating bath is determined by titration of a sample containing a small concentration of free fluoride ion with standard lanthanum nitrate which reacts preferentially with the citrate and then with fluoride ion. The endpoint is indicated by a decrease in fluoride ion concentration, detected via a fluoride ion specific electrode (ISE)."

 

Home Page ... The Institute ... About Cobalt ... Cobalt News ... Cobalt Facts ... Cobalt Abstracts ... World Patents ...  
HS & E ... Statistics ... Conferences ... Publications ... News ... Links ... Members Directory ... Contact Us